DocumentCode
2713933
Title
Session Summary V: Is Component Interconnection Test Enough for Board or System Test
Author
Gu, Xingfa
fYear
2012
fDate
19-22 Nov. 2012
Firstpage
270
Lastpage
270
Abstract
Summary form only given, as follows. This panel discusses board/system level test requirements, current test technologies and challenges. We will also discuss what future new standards, technologies and tools are necessary to improve both the test quality and test efficiency for production boards. This panel will cover from an end-to-end standpoint to improve product quality and reliability, including DFT technologies in ASIC components, boards/systems, and intelligent diagnosis.
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium (ATS), 2012 IEEE 21st Asian
Conference_Location
Niigata, Japan
ISSN
1081-7735
Print_ISBN
978-1-4673-4555-2
Electronic_ISBN
1081-7735
Type
conf
DOI
10.1109/ATS.2012.84
Filename
6394213
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