• DocumentCode
    2713933
  • Title

    Session Summary V: Is Component Interconnection Test Enough for Board or System Test

  • Author

    Gu, Xingfa

  • fYear
    2012
  • fDate
    19-22 Nov. 2012
  • Firstpage
    270
  • Lastpage
    270
  • Abstract
    Summary form only given, as follows. This panel discusses board/system level test requirements, current test technologies and challenges. We will also discuss what future new standards, technologies and tools are necessary to improve both the test quality and test efficiency for production boards. This panel will cover from an end-to-end standpoint to improve product quality and reliability, including DFT technologies in ASIC components, boards/systems, and intelligent diagnosis.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium (ATS), 2012 IEEE 21st Asian
  • Conference_Location
    Niigata, Japan
  • ISSN
    1081-7735
  • Print_ISBN
    978-1-4673-4555-2
  • Electronic_ISBN
    1081-7735
  • Type

    conf

  • DOI
    10.1109/ATS.2012.84
  • Filename
    6394213