DocumentCode
2714305
Title
The Stacking of Integrated Passive Devices, Substrates, and RFICs to make ultra-thin modules using Organic Liquid Crystalline Polymer (LCP) Technology
Author
Dekosky, J. ; Lapushin, S. ; Dalmia, S. ; Czakon, W. ; White, G.
Author_Institution
Jacket Micro Devices, Atlanta, GA
fYear
2006
fDate
11-16 June 2006
Firstpage
1257
Lastpage
1260
Abstract
This paper presents the design of a 3 pole WLAN filter that utilizes integrated passive device (IPD) attached to a substrate to reduce size and improve filter performance increase yield, and achieve thinner modules. The design uses liquid crystalline polymer (LCP) technology as an alternative to LTCC and discrete solutions
Keywords
liquid crystal polymers; passive filters; radiofrequency integrated circuits; wireless LAN; LCP technology; RFIC; WLAN filter; integrated passive device; integrated passive devices; organic liquid crystalline polymer; ultra-thin modules; Assembly; Crystallization; Impedance matching; Liquid crystal devices; Liquid crystal polymers; Passive filters; Radiofrequency integrated circuits; Routing; Stacking; Wireless LAN;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2006. IEEE MTT-S International
Conference_Location
San Francisco, CA
ISSN
0149-645X
Print_ISBN
0-7803-9541-7
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2006.249439
Filename
4015151
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