Title :
The Stacking of Integrated Passive Devices, Substrates, and RFICs to make ultra-thin modules using Organic Liquid Crystalline Polymer (LCP) Technology
Author :
Dekosky, J. ; Lapushin, S. ; Dalmia, S. ; Czakon, W. ; White, G.
Author_Institution :
Jacket Micro Devices, Atlanta, GA
Abstract :
This paper presents the design of a 3 pole WLAN filter that utilizes integrated passive device (IPD) attached to a substrate to reduce size and improve filter performance increase yield, and achieve thinner modules. The design uses liquid crystalline polymer (LCP) technology as an alternative to LTCC and discrete solutions
Keywords :
liquid crystal polymers; passive filters; radiofrequency integrated circuits; wireless LAN; LCP technology; RFIC; WLAN filter; integrated passive device; integrated passive devices; organic liquid crystalline polymer; ultra-thin modules; Assembly; Crystallization; Impedance matching; Liquid crystal devices; Liquid crystal polymers; Passive filters; Radiofrequency integrated circuits; Routing; Stacking; Wireless LAN;
Conference_Titel :
Microwave Symposium Digest, 2006. IEEE MTT-S International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-9541-7
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2006.249439
