DocumentCode
2714629
Title
Integrated Raman - IR Thermography on AlGaN/GaN Transistors
Author
Kuball, Martin ; Sarua, Andrei ; Ji, Hong ; Uren, Michael J. ; Balmer, Richard S. ; Martin, Trevor
Author_Institution
Bristol Univ.
fYear
2006
fDate
11-16 June 2006
Firstpage
1339
Lastpage
1342
Abstract
We report on the integrated Raman-IR thermography analysis of AlGaN/GaN heterostructure field effect transistors (HFETs). IR thermography provides fast temperature overviews while micro-Raman enables accurate peak temperature determination with high spatial resolution in selected device areas. Excellent agreement between Raman determined device temperatures and finite difference simulations was achieved in the active device region. IR provided temperature determination over large device areas, and complemented the Raman thermal data. In IR thermography, lateral averaging of temperature in the small active device region resulted in an underestimation of device peak temperature and an overestimation of temperature profile linewidth. Dependent on device layout, depth averaging of device temperature occurs in IR thermography. The developed novel approach opens unique possibilities for the thermal screening of MMICs and reliability optimization
Keywords
III-V semiconductors; Raman spectra; aluminium compounds; gallium compounds; high electron mobility transistors; infrared imaging; semiconductor device measurement; semiconductor device reliability; temperature measurement; wide band gap semiconductors; AlGaN-GaN; MMIC; Raman scattering; finite difference simulations; heterostructure field effect transistors; infrared image sensors; integrated Raman-IR thermography; semiconductor device reliability; semiconductor device thermal factors; temperature determination; Aluminum gallium nitride; Field effect MMICs; Gallium nitride; HEMTs; MODFETs; Materials reliability; Spatial resolution; Temperature dependence; Temperature measurement; Temperature sensors; FETs; MMICs; Raman scattering; infrared image sensors; semiconductor device reliability; semiconductor device thermal factors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2006. IEEE MTT-S International
Conference_Location
San Francisco, CA
ISSN
0149-645X
Print_ISBN
0-7803-9541-7
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2006.249496
Filename
4015172
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