Title :
FDC R2R variation monitoring for sensor level diagnosis in tool condition hierarchy
Author :
Blue, Jakey ; Roussy, Agnès ; Pinaton, Jacques
Author_Institution :
Dept. of Sci. of Fabrication &Logistics, EMSE-CMP, Gardanne, France
Abstract :
Tool behavior modeling and diagnosis is a big challenge in modern semiconductor fabrication, in particular for the foundry and analog companies with high product-mix and complicated technology nodes. Tool condition monitoring has been practiced by implementing the FDC (Fault Detection and Classification) system and analyzing large amount of real-time equipment data. This paper continues the work of tool condition hierarchy, where the excursions can be detected in one single overall tool indicator and are intuitively drilled down to the level of sensor groups. A R2R (Run-to-Run) variation monitoring technique is developed in order to correlate the tool faults with single sensor and thus completes the diagnostic gap of the hierarchy. The tool condition monitoring then becomes efficient and tool fault diagnosis can be systematically top-down.
Keywords :
condition monitoring; fault diagnosis; integrated circuit manufacture; integrated circuit technology; FDC R2R variation monitoring; analog companies; complicated technology nodes; fault detection and classification; foundry companies; one single overall tool indicator; product-mix; real-time equipment data; run-to-run variation monitoring; semiconductor fabrication; sensor level diagnosis; tool behavior diagnosis; tool behavior modeling; tool condition hierarchy; tool condition monitoring; Condition monitoring; Fault diagnosis; Monitoring; Production; Synchronization; Temperature sensors; FDC; FDC profile synchronization; SPC; recipe grouping; run-to-run variation; tool condition hierarchy; tool fault diagnosis;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location :
Saratoga Springs, NY
DOI :
10.1109/ASMC.2014.6846984