• DocumentCode
    2715431
  • Title

    Process Variation Study for Silicon Nanowire Transistors

  • Author

    Mehrotra, Saumitra R ; Roenker, K.P.

  • Author_Institution
    Electrical & Computer Engineering, University of Cincinnati, Cincinnati, OH 45220 USA
  • fYear
    2007
  • fDate
    20-20 April 2007
  • Firstpage
    40
  • Lastpage
    41
  • Abstract
    This paper examines the sensitivity of silicon nanowire transistors to process variations. Silicon nanowire MOSFETs are effective in controlling short channel effects, but at the same time suffer from threshold voltage degradation due to the quantum confinement effect. In this study we have investigated the effects on the device characteristics of process variations due to body thickness, gate length and gate dielectric thickness. The results have been compared with previous results for the FinFET and the differences quantified. The nanowire MOSFET is found to exhibit significantly less short channel effects relative to a comparable FinFET structure, but to have a larger threshold voltage variation with the diameter at a diameter less than 4 nm.
  • Keywords
    FETs; Fabrication; FinFETs; Integrated circuit technology; MOSFETs; Nanoscale devices; Potential well; Silicon; Threshold voltage; Transistors; NEGF; Silicon nanowire transistors; process variation; quantum confinement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Electron Devices, 2007. WMED 2007. IEEE Workshop on
  • Conference_Location
    Boise, ID, USA
  • Print_ISBN
    1-4244-1114-9
  • Electronic_ISBN
    1-4244-1114-9
  • Type

    conf

  • DOI
    10.1109/WMED.2007.368055
  • Filename
    4218998