DocumentCode
2715642
Title
Direct bonding of piezoelectric materials onto Si
Author
Eda, Kazuo ; Tomita, Yoshihiro ; Sugimoto, Masato ; Ogura, Tetsuyoshi ; Nanba, Aluhiko ; Taguchi, Yutaka ; Kawasaki, Osamu
Author_Institution
Dev. Eng. Dev. Centre, Matsushita Electr. Ind. Co. Ltd., Kadoma, Japan
Volume
2
fYear
1996
fDate
18-21 Aug 1996
Firstpage
719
Abstract
New composite semiconductor-piezoelectric materials fabricated by direct bonding technology are reported. The fabrication process, analysis of the bonded interface microstructures, and their applications are also reported
Keywords
composite material interfaces; composite materials; elemental semiconductors; piezoelectric materials; silicon; wafer bonding; Si; composite semiconductor-piezoelectric material; direct bonding; fabrication; interface microstructure; Bonding forces; Crystalline materials; Crystallization; Fabrication; Microstructure; Piezoelectric devices; Piezoelectric materials; Semiconductor materials; Space technology; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Applications of Ferroelectrics, 1996. ISAF '96., Proceedings of the Tenth IEEE International Symposium on
Conference_Location
East Brunswick, NJ
Print_ISBN
0-7803-3355-1
Type
conf
DOI
10.1109/ISAF.1996.598125
Filename
598125
Link To Document