• DocumentCode
    2715761
  • Title

    Silicon micromachining technology for THz applications

  • Author

    Jung, C. ; Lee, C. ; Thomas, B. ; Chattopadhyay, G. ; Peralta, A. ; Lin, R. ; Gill, J. ; Mehdi, I.

  • Author_Institution
    Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    2010
  • fDate
    5-10 Sept. 2010
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Silicon micromachining technology is naturally suited for making THz components, where precision and accuracy are essential. We report here the development of a robust micromachining technology that has enabled us to make waveguide features in the 325 to 500 GHz range with nominal losses. Extension of this technology towards a wafer-level integrated submillimeter-wave receiver front-end is also discussed. This novel wafer-stacking architecture will enable ultra-compact two dimensional multi-pixel receiver front-ends in the THz range.
  • Keywords
    micromachining; radiometers; surface roughness; surface topography measurement; terahertz wave devices; THz applications; silicon micromachining technology; ultra compact 2D multi-pixel receiver front-ends; wafer-level integrated submillimeter-wave receiver front-end; Metals; Micromachining; Receivers; Silicon; Surface roughness; Surface waves; Waveguide components;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Infrared Millimeter and Terahertz Waves (IRMMW-THz), 2010 35th International Conference on
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-6655-9
  • Type

    conf

  • DOI
    10.1109/ICIMW.2010.5612771
  • Filename
    5612771
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2715761