Characteristics of Microstrip Lines through a Metalized EBG Substrate

Author

Yang, H. Y David ; Zhou, Chengzhi

Author_Institution

Dept. of Electr. & Comput. Eng., Illinois Univ., Chicago, IL

fYear

2006

fDate

11-16 June 2006

Firstpage

1655

Lastpage

1658

Abstract

This paper presents the analysis of a microstrip line surrounded by metalized substrates. The metalized substrates are dielectric substrates with vias through and either with or without patch covers. The guided-wave characteristics are investigated by full-wave electromagnetic simulations with experimental verification. It is found that the metalized substrate would increase the phase constant (slow-wave factor) and decrease the characteristic impedance of a microstrip line. When a microstrip line is in contact with the surrounding vias, the structure is in analogy to a metallic waveguide with a cut-off frequency. The mode properties are also characterized

Keywords

dielectric waveguides; electromagnetic wave propagation; microstrip lines; photonic band gap; substrates; EBG substrate; characteristic impedance; dielectric substrates; electromagnetic band-gap; full-wave electromagnetic simulations; guided-wave characteristics; metalized substrate; metallic waveguide; microstrip lines; propagation constant; surrounding vias; Application specific integrated circuits; Dielectric substrates; Distributed parameter circuits; Impedance; Metamaterials; Microstrip; Periodic structures; Propagation constant; Surface waves; Transmission line theory; Microstrip lines; characteristic impedance; electromagnetic band-gap; guided-wave; propagation constant;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2006. IEEE MTT-S International

Conference_Location

San Francisco, CA

ISSN

0149-645X

Print_ISBN

0-7803-9541-7

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2006.249675

Filename

4015261