Title :
Integrated Flex Winding Realisation for 3D PCB Converters
Author :
de Jong, E.C.W. ; Ferreira, Jan Abraham ; Bauer, Pavol
Author_Institution :
Delft Univ. of Technol.
Abstract :
The implementation of flexible printed circuit technology in power magnetic winding design is investigated. At first this implementation is considered as a stand-alone winding technology for discrete magnetic components and thereafter it is applied as an integral winding technology, enabling enhanced manufacturing possibility for an integrated 3D converter concept, discussed herein. Optimisation of both the material- and layer usage in the winding stack realisation is found to be the key to minimising the manufacturing cost of such a PCB fabricated winding stack, as well as improving its interconnection reliability. The associated folding pattern of the winding panels, in conjunction with the winding patterns themselves, receive meticulous attention during the proposed winding design method. The manufacturing complexity and cost advantages of using double sided, flexible printed circuit technology to realise a planar winding stack by the proposed folding method, that would otherwise require a substantial number of costly, rigid printed circuit layers, is brought to the forefront. Also the possibility to exploit the parasitic elements of the magnetic component as functional resonant tank elements, using the folding pattern design is investigated. Practical validation of an integrated magnetic component suitable for a 3D PCB converter is presented along with critical evaluation of the results
Keywords :
flexible electronics; magnetic devices; power convertors; printed circuit design; windings; 3D PCB converters; PCB fabricated winding stack; discrete magnetic components; flexible printed circuit technology; folding method; functional resonant tank elements; integrated 3D converter concept; integrated flex winding realisation; planar winding stack; power magnetic winding design; stand-alone winding technology; winding panels; winding patterns; winding stack; Conductors; Cost function; Flexible printed circuits; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit technology; Magnetic resonance; Manufacturing processes; Power electronics; Printed circuits;
Conference_Titel :
Power Electronics Specialists Conference, 2006. PESC '06. 37th IEEE
Conference_Location :
Jeju
Print_ISBN :
0-7803-9716-9
DOI :
10.1109/PESC.2006.1712207