• DocumentCode
    2717025
  • Title

    Improved Smart Power Modules for up to 7kW Motor Drive Applications

  • Author

    Jun-Bae Lee ; Dae-Woong Chung ; Bum-Seok Suh ; Dong-Seok Hyun

  • Author_Institution
    Motion Control System Team, Functional Power Group, Fairchild Semiconductor, 82-3, Dodang-Dong, Wonmi-Gu, Bucheon-Si, Gyeonggi-Do, KOREA, E-mail: jb.lee@fairchildsemi.co.kr
  • fYear
    2006
  • fDate
    18-22 June 2006
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This paper introduces the improved Motion-SPM™ (Smart Power Modules) in DIP package, which is fully optimized intelligent integrated IGBT inverter modules for up to 7kW motor drive applications. Although its external size is same as a previous iteration of Motion-SPM in DIP, the operating current rating has been increased to 75A compared to an earlier iteration of Motion-SPM of 30A. It comes to be small by employing size-related design and highly integrated building blocks having the built-in HVICs. It also provides technical advantages such as the good thermal performances through DBC(Direct Bonded Copper), the high latch immunity and dv/dt controlled HVIC driving. This paper provides an overall description of the improved Motion-SPM in DIP as well as actual application issues such as electrical characteristics, circuit configurations, thermal performance and power ratings.
  • Keywords
    Bonding; Circuits; Copper; Electric variables; Electronics packaging; Insulated gate bipolar transistors; Inverters; Latches; Motor drives; Multichip modules;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Specialists Conference, 2006. PESC '06. 37th IEEE
  • ISSN
    0275-9306
  • Print_ISBN
    0-7803-9716-9
  • Type

    conf

  • DOI
    10.1109/PESC.2006.1712209
  • Filename
    1712209