Brain-implantable biomimetic electronics as neural prosthetics

Author

Berger, Theodore W. ; Granacki, John J. ; Marmarelis, Vasilis Z. ; Sheu, Bing J. ; Tanguay, Armand R., Jr.

Author_Institution

Dept. of Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA

Volume

2

fYear

2003

fDate

17-21 Sept. 2003

Firstpage

1956

Abstract

Described in this paper is an interdisciplinary effort that will enable the functions of specific brain damaged regions to be replaced by "neurocomputational" microchips that incorporate experimentally-based mathematical models of the nonlinear dynamic properties of biological neurons. To allow the "neurocomputational" microchips to communicate with existing brain tissue, another microcircuitry element has been developed-silicon-based multielectrode arrays that are "neuromorphic", i.e., designed to conform to the region-specific cytoarchitecture of the brain. When the "neurocomputational" and "neuromorphic" components are fully integrated, the envisioned prosthetic will receive electrical impulses from targeted subregions of the brain, process the information using the hardware model of that brain region, and communicate back to the functioning brain.

Keywords

VLSI; bioelectric phenomena; biological tissues; biomedical electrodes; biomedical electronics; biomimetics; brain; elemental semiconductors; medical signal processing; neurophysiology; physiological models; prosthetics; silicon; Si; VLSI; biological neurons; biomimetic electronics; brain tissue; brain-implants; hardware model; hippocampus; mathematical models; microcircuitry element; multielectrode arrays; neural prosthetics; neurocomputational microchips; neuromorphic; neuron-silicon interface; nonlinear dynamics; Biomedical engineering; Biomimetics; Brain; Circuits; Electrical stimulation; Hippocampus; Materials science and technology; Neurons; Prosthetics; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Engineering in Medicine and Biology Society, 2003. Proceedings of the 25th Annual International Conference of the IEEE

ISSN

1094-687X

Print_ISBN

0-7803-7789-3

Type

conf

DOI

10.1109/IEMBS.2003.1279827

Filename

1279827