DocumentCode :
2717180
Title :
Brain-implantable biomimetic electronics as neural prosthetics
Author :
Berger, Theodore W. ; Granacki, John J. ; Marmarelis, Vasilis Z. ; Sheu, Bing J. ; Tanguay, Armand R., Jr.
Author_Institution :
Dept. of Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA
Volume :
2
fYear :
2003
fDate :
17-21 Sept. 2003
Firstpage :
1956
Abstract :
Described in this paper is an interdisciplinary effort that will enable the functions of specific brain damaged regions to be replaced by "neurocomputational" microchips that incorporate experimentally-based mathematical models of the nonlinear dynamic properties of biological neurons. To allow the "neurocomputational" microchips to communicate with existing brain tissue, another microcircuitry element has been developed-silicon-based multielectrode arrays that are "neuromorphic", i.e., designed to conform to the region-specific cytoarchitecture of the brain. When the "neurocomputational" and "neuromorphic" components are fully integrated, the envisioned prosthetic will receive electrical impulses from targeted subregions of the brain, process the information using the hardware model of that brain region, and communicate back to the functioning brain.
Keywords :
VLSI; bioelectric phenomena; biological tissues; biomedical electrodes; biomedical electronics; biomimetics; brain; elemental semiconductors; medical signal processing; neurophysiology; physiological models; prosthetics; silicon; Si; VLSI; biological neurons; biomimetic electronics; brain tissue; brain-implants; hardware model; hippocampus; mathematical models; microcircuitry element; multielectrode arrays; neural prosthetics; neurocomputational microchips; neuromorphic; neuron-silicon interface; nonlinear dynamics; Biomedical engineering; Biomimetics; Brain; Circuits; Electrical stimulation; Hippocampus; Materials science and technology; Neurons; Prosthetics; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2003. Proceedings of the 25th Annual International Conference of the IEEE
ISSN :
1094-687X
Print_ISBN :
0-7803-7789-3
Type :
conf
DOI :
10.1109/IEMBS.2003.1279827
Filename :
1279827
Link To Document :
بازگشت