DocumentCode
2717453
Title
Macro-Modeling of High-speed Digital Board to Package Interconnections
Author
Kim, Jung-Min ; Du, Jin-Kyoung ; Kim, Yong-Ju ; Kim, Hyungsoo ; Park, Kun-Woo ; Kih, Joong-Sik ; Yook, Jong-Gwan
Author_Institution
Dept. of Electr. & Electron. Eng., Yonsei Univ., Seoul
fYear
2006
fDate
11-16 June 2006
Firstpage
1959
Lastpage
1962
Abstract
The pole and residue values from vector fitting method were applied in this paper, which enables the extraction and implementation of the equivalent circuit to achieve the characteristics of board to package model for GHz frequency range. After the full-wave EM simulation of package model, the mathematical functions are derived by the frequency domain responses of EM simulation. The equivalent circuit model and simulation show good correlation, further verifying the accuracy of the simulated EM data and extracted circuit model. Fourier series of clock pulse to the extracted equivalent circuit provides an approach to tremendously reduced simulation time of the frequency and time domain for the high-speed digital system
Keywords
Fourier series; equivalent circuits; high-speed integrated circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; Fourier series; board to package model; equivalent circuit; frequency domain response; full-wave EM simulation; mathematical functions; vector fitting; Circuit simulation; Clocks; Data mining; Equivalent circuits; Fourier series; Frequency domain analysis; Integrated circuit interconnections; Mathematical model; Packaging; Pulse circuits; Vector fitting; frequency domain EM simulation; macro-modeling; package model; time domain simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2006. IEEE MTT-S International
Conference_Location
San Francisco, CA
ISSN
0149-645X
Print_ISBN
0-7803-9541-7
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2006.249818
Filename
4015343
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