Screening the reliable semiconductor chips by laser acceleration of deep level recombination. Process certification for industrial application

Author

Galateanu, L. ; Bazu, M. ; Lian, V.I. ; Tibeica, C. ; Petu, A. ; Apostol, D. ; Damian, V.

Author_Institution

Nat. Inst. R&D in Microtechnol., Bucharest, Romania

Volume

2

fYear

2004

fDate

4-6 Oct. 2004

Firstpage

299

Abstract

A new technological process, devoted to screen the reliable semiconductor chips before the assembly processes, was developed. The acceleration of minority carriers generation-recombination at deep level centers by laser irradiation of semiconductor chips is used. An 84% efficiency of the screening method was evaluated. In order to allow the industrial utilization of the process, a method to prove and certificate the screening performances is proposed. An important increasing of production efficiency is obtained because of the high weight of packaging costs.

Keywords

MMIC; deep levels; electron-hole recombination; electronics industry; electronics packaging; integrated circuit manufacture; integrated circuit reliability; laser beam effects; microassembling; power integrated circuits; power transistors; assembly process; deep level centers; deep level recombination; industrial application; laser acceleration; laser irradiation; minority carriers generation; minority carriers recombination; process certification; production efficiency; reliable semiconductor chips screening; Acceleration; Certification; Degradation; Failure analysis; Power transistors; Radiative recombination; Radio frequency; Semiconductor device reliability; Semiconductor device testing; Semiconductor lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 2004. CAS 2004 Proceedings. 2004 International

Print_ISBN

0-7803-8499-7

Type

conf

DOI

10.1109/SMICND.2004.1402999

Filename

1402999