• DocumentCode
    2718163
  • Title

    Analysis of high temperature SOI micro-hotplates

  • Author

    Ali, S.Z. ; Gonzalez, W. ; Gardner, J.W. ; Udrea, F.

  • Author_Institution
    Dept. of Eng., Cambridge Univ., UK
  • Volume
    2
  • fYear
    2004
  • fDate
    4-6 Oct. 2004
  • Firstpage
    351
  • Abstract
    This work reports on the analysis and modelling of novel, tungsten-based SOI micro-hotplates for smart silicon-based gas sensors. Tungsten has very good physical properties for use in micro-heaters, is CMOS compatible, and can be used as an interconnect in CMOS circuits. Compared to current commercial solid state gas sensors, gas sensors based on these micro-hotplates offer low power consumption, full CMOS compatibility and low cost, achieved through smart CMOS integration of the sensing device, transducers, and MOSFET drive circuitry. Electro-thermal simulations and mathematical analysis are presented. In addition, mechanical stresses resulting from the high temperatures reached are also analysed.
  • Keywords
    CMOS integrated circuits; MOSFET circuits; elemental semiconductors; gas sensors; integrated circuit interconnections; intelligent sensors; internal stresses; mathematical analysis; power consumption; semiconductor device models; silicon; silicon-on-insulator; thermal analysis; thermal expansion; transducers; tungsten; CMOS circuits; CMOS compatibility; MOSFET drive circuitry; Si; W-SiO2; electro-thermal simulations; high temperature tungsten based SOI microhotplates; interconnection; mathematical analysis; mechanical stresses; microheaters; physical properties; power consumption; sensing device; smart CMOS integration; smart silicon based gas sensors; solid state gas sensors; transducers; Costs; Energy consumption; Gas detectors; Integrated circuit interconnections; MOSFET circuits; Semiconductor device modeling; Solid state circuits; Temperature sensors; Transducers; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference, 2004. CAS 2004 Proceedings. 2004 International
  • Print_ISBN
    0-7803-8499-7
  • Type

    conf

  • DOI
    10.1109/SMICND.2004.1403015
  • Filename
    1403015