High-performance on-chip network platform for memory-on-processor architectures

Three Dimensional Integrated Circuits (3D ICs) are emerging to improve existing Two Dimensional (2D) designs by providing smaller chip areas, higher performance and lower power consumption. Stacking memory layers on top of a multiprocessor layer (logic layer) is a potential solution to reduce wire delay and increase the bandwidth. To fully employ this capability, an efficient on-chip communication platform is required to be integrated in the logic layer. In this paper, we present an on-chip network platform for the logic layer utilizing an efficient network interface to exploit the potential bandwidth of stacked memory-on-processor architectures. Experimental results demonstrate that the platform equipped with the presented network interface increases the performance considerably.