Inverse heat conduction problems in electronics with special consideration of analytical analysis methods

Author

Janicki, M. ; Napieralski, A.

Author_Institution

Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Poland

Volume

2

fYear

2004

fDate

4-6 Oct. 2004

Firstpage

455

Abstract

This work is an overview of the most important issues related to the thermal analysis of the microelectronic circuits. First, the heat transfer modelling through the heat equation and its solution methods are introduced. Particular stress is laid on the analytical methods for the solution of heat equation, which can be successfully applied for solving a large variety of thermal problems. Then, the process of electronic circuit thermal model creation and its possible applications for the solution of various inverse problems are discussed.

Keywords

cooling; heat conduction; integrated circuit modelling; inverse problems; thermal analysis; analytical analysis methods; electronic circuit thermal model creation; heat equation; heat transfer modelling; inverse heat conduction problems; microelectronic circuits; thermal analysis; thermal problems; Boundary conditions; Differential equations; Electronic circuits; Heat transfer; Microelectronics; Partial differential equations; Solids; Temperature; Thermal conductivity; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 2004. CAS 2004 Proceedings. 2004 International

Print_ISBN

0-7803-8499-7

Type

conf

DOI

10.1109/SMICND.2004.1403047

Filename

1403047