DocumentCode :
271944
Title :
Average Power Handling Capability of Microstrip Passive Circuits Considering Metal Housing and Environment Conditions
Author :
Sánchez-Soriano, Miguel Á ; Queré, Yves ; Le Saux, Vincent ; Quendo, C. ; Cadiou, S.
Author_Institution :
Lab. des Sci. et Tech. de l´Inf., Univ. de Bretagne Occidentale, Brest, France
Volume :
4
Issue :
10
fYear :
2014
fDate :
Oct. 2014
Firstpage :
1624
Lastpage :
1633
Abstract :
In this paper, the average power handling capability (APHC) of microstrip passive circuits considering the metal housing and environment conditions is investigated in detail. A systematic method is proposed for the computation of the APHC of microstrip circuits in open and enclosed metal housing configurations, typically used in microwave components. The method also yields an estimate of the maximum temperature in a microstrip circuit for a given input power. Closed-form equations accounting for external conditions, such as convection or radiation heat transfer are given to evaluate the APHC. For validation, two microstrip bandstop filters centered at 10 GHz are analyzed following the proposed model, and the results are compared with those simulated showing a good agreement. In addition, both circuits are fabricated and characterized. Thermal profile measurements are provided, confirming the predicted results. The effect of the topology layout and the electromagnetic performance on the APHC are also discussed.
Keywords :
band-stop filters; microstrip circuits; packaging; passive networks; APHC; average power handling capability; closed-form equations; convection; enclosed metal housing configurations; environment conditions; frequency 10 GHz; microstrip bandstop filters; microstrip passive circuits; open metal housing configurations; radiation heat transfer; Dielectrics; Heat transfer; Heating; Metals; Microstrip; Passive circuits; Temperature measurement; Average power handling capability (APHC); electrothermal analysis; metal housing; microwave devices; planar circuits; power applications;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2014.2345100
Filename :
6883211
Link To Document :
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