Analytic method for monitoring of cleaning process efficiency

This paper is focused on cleaning processes commonly used in electronic industry. Cleaning equipment serve to remove residual contamination after soldering of components in order to achieve the highest possible reliability and efficiency. In the real cleaning process is not possible during cleaning process to move products outside from equipment to make evaluation of cleaning efficiency. Generally there are only few possibilities for cleaning evaluation, which are the optical control, chemical analyze and surface insulation resistance measurement. Because these methods are not applicable inside the equipment, new method was developed for the efficiency evaluation. This article presents new calibration principle, where the base is quantification of residual contamination by the optical analyze.