Mechanical strength of joints based on nano-Ag sintering phenomena

Author

Falat, Tomasz ; Matkowski, PrzemysÅ‚aw ; Zaluk, Zbigniew ; Felba, Jan ; Moscicki, A.

Author_Institution

Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wrocław, Poland

fYear

2014

fDate

7-11 May 2014

Firstpage

365

Lastpage

368

Abstract

Thermal Interface Materials are used in microelectronic packaging for reducing so called thermal resistance between heat source and heat sink. They are commonly used, often in form of thermally conductive adhesives, as an attaching materials for fixing silicon chips in the integrated circuits. Therefore, beside the thermal properties, a good mechanical strength of TIMs is required. Within this paper the shear strength of few different sintered nanoAg-based pastes used as TIM is examined.

Keywords

conductive adhesives; heat sinks; integrated circuit packaging; mechanical strength; nanostructured materials; silver alloys; sintering; thermal resistance; Ag; TIMs; heat sink; heat source; integrated circuits; joints mechanical strength; microelectronic packaging; nano-silver paste sintering phenomena; silicon chip fixing; thermal interface materials; thermal properties; thermal resistance; thermally conductive adhesives; Copper; Electronic packaging thermal management; Joints; Silicon; Silver; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on

Conference_Location

Dresden

Type

conf

DOI

10.1109/ISSE.2014.6887626

Filename

6887626