Title :
Mechanical strength of joints based on nano-Ag sintering phenomena
Author :
Falat, Tomasz ; Matkowski, Przemysław ; Zaluk, Zbigniew ; Felba, Jan ; Moscicki, A.
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wrocław, Poland
Abstract :
Thermal Interface Materials are used in microelectronic packaging for reducing so called thermal resistance between heat source and heat sink. They are commonly used, often in form of thermally conductive adhesives, as an attaching materials for fixing silicon chips in the integrated circuits. Therefore, beside the thermal properties, a good mechanical strength of TIMs is required. Within this paper the shear strength of few different sintered nanoAg-based pastes used as TIM is examined.
Keywords :
conductive adhesives; heat sinks; integrated circuit packaging; mechanical strength; nanostructured materials; silver alloys; sintering; thermal resistance; Ag; TIMs; heat sink; heat source; integrated circuits; joints mechanical strength; microelectronic packaging; nano-silver paste sintering phenomena; silicon chip fixing; thermal interface materials; thermal properties; thermal resistance; thermally conductive adhesives; Copper; Electronic packaging thermal management; Joints; Silicon; Silver; Substrates;
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
DOI :
10.1109/ISSE.2014.6887626
