• DocumentCode
    271984
  • Title

    Influence of coil design on sensing performance of pressure sensor with polyimide membrane

  • Author

    Kisić, Milica G. ; Blaž, Nelu V. ; Marić, Andrea M. ; Radosavljević, Goran J. ; Živanov, Ljiljana D. ; Damnjanović, Mirjana S.

  • Author_Institution
    Dept. of Power, Electron. & Telecommun. Eng., Univ. of Novi Sad, Novi Sad, Serbia
  • fYear
    2014
  • fDate
    7-11 May 2014
  • Firstpage
    421
  • Lastpage
    426
  • Abstract
    The objective of this research is to study various coil designs and to propose the pattern that can improve the performance of the pressure sensor. Wireless pressure sensor, based on polyimide foil, is designed, fabricated and tested. The proposed sensor is realised in heterogonous integration process and consists of PCB (Printed Circuit Board) coil, spacer and polyimide membrane with attached LTCC (Low Temperature Co-fired Ceramic) ferrite. Pressure variations are wirelessly detected in system antenna-sensor resonant frequency, by a phase-dip technique. The distance between the coil and the ferrite varies with an applied external pressure and consequently membrane deflection, so the inductance of the coil increases and the resonant frequency of the system decreases. The effect of coil designs with different number of turns is examined and sensor performances are compared. Experimental measurements are determined and confirmed by analytical calculations and simulated results.
  • Keywords
    ceramic packaging; coils; ferrites; foils; polymer films; pressure sensors; wireless sensor networks; LTCC ferrite; PCB coil; coil designs; heterogeneous integration process; low temperature cofired ceramic; phase-dip technique; polyimide foil; polyimide membrane; printed circuit board; sensor performances; spacer; system antenna-sensor resonant frequency; wireless pressure sensor; Antenna measurements; Antennas; Coils; Ferrites; Inductance; Resonant frequency; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
  • Conference_Location
    Dresden
  • Type

    conf

  • DOI
    10.1109/ISSE.2014.6887637
  • Filename
    6887637