Title :
Re-engineering solutions for Y2K challenge
Author_Institution :
Software Factory Dept., Fujitsu Labs. Ltd., Japan
Abstract :
The technologies to solve the Y2K problem are re-engineering technologies. Many tools are provided by tool venders to support various areas of Y2K activities. These activities are categorized into the following phases: the preparation phase, the analysis and design phase, the modification phase, and the testing and verification phase. Among these, the key phase is the analysis and design phase. The key technology is often called impact analysis or ripple effect analysis, which helps customers to identify source code that needs to be modified. Fujitsu has developed RWB/2000 for this problem which uses an OODB-based repository and global ripple effect analysis. However, there are no automatic tools to change/fix all the source code which requires modification. Also, the required effort and times heavily depend on customers´ current status of applications and their related standardization and documentation. This is why the Y2K project manager has such difficulties making their Y2K plan. We have a maximum of 2 years 5 months to complete the project. Set up the Y2K project as early as possible and start by examining your application system. Identify your completion date for Y2K compliance and start a pilot project to make more accurate plans, and execute it
Keywords :
data integrity; project management; software maintenance; software management; systems re-engineering; Fujitsu; OODB-based repository; RWB/2000; Y2K problem; Year 2000 problem; analysis and design phase; impact analysis; modification phase; preparation phase; re-engineering solutions; re-engineering technologies; ripple effect analysis; source code; testing and verification phase; Documentation; Packaging; Production facilities; Project management; Standardization; Standards development; System testing;
Conference_Titel :
Computer Software and Applications Conference, 1997. COMPSAC '97. Proceedings., The Twenty-First Annual International
Conference_Location :
Washington, DC
Print_ISBN :
0-8186-8105-5
DOI :
10.1109/CMPSAC.1997.624837