Title :
Table of contents
Abstract :
The following topics are dealt with: modern MEMS package; fabrication and packaging; model order reduction; energy harvesting; sensors and actuators; textile microsystems; hermeticity tests in MEMS; high added value MEMS; networked microsystems for green and life innovation; embossing and mould; drie technology; reliability, testing, and measurement; and bioMEMS/NEMS.
Keywords :
actuators; bioMEMS; electronics packaging; energy harvesting; micromechanical devices; moulding; reliability; sensors; actuator; bioMEMS; bioNEMS; drie technology; embossing; energy harvesting; hermeticity test; model order reduction; modern MEMS package; moulding; networked microsystem; reliability; sensor; textile microsystem;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2011 Symposium on
Conference_Location :
Aix-en-Provence
Print_ISBN :
978-1-61284-905-8
