622 Mbit/s board-to-board link in 0.5 μm CMOS technology

Author

Gogaert, S. ; Steyeart, M. ; Peluso, V.

Author_Institution

ESAT-MICAS, Katholieke Univ., Leuven, Belgium

fYear

1995

fDate

1-4 May 1995

Firstpage

447

Lastpage

450

Abstract

High speed digital processing chips demand also high speed interconnections. On-board communication with a limited distance have already been realised. However in this paper an inter board communication over a relative long distance is presented. To minimise signal reflections in this kind of communication networks a special termination circuit has been developed. This impedance termination can be tuned to match the characteristic impedance of the transmission wire. Using this termination circuit a driver and receiver are designed. Transmission rates up to 800 Mbit/s have been measured. The two boards are connected to each other with a twin ax shielded wire plugged in the backplane connector of the two PCBs. To allow integration with the digital processing chips a standard CMOS process is used to realise the driver and receiver chips

Keywords

CMOS digital integrated circuits; digital signal processing chips; impedance matching; integrated circuit interconnections; 0.5 micron; 622 Mbit/s; CMOS technology; PCBs; backplane connector; board-to-board link; digital processing chips; driver; high speed interconnections; impedance matching; inter board communication; receiver; signal reflections; termination circuit; transmission wire; twin ax shielded wire; Backplanes; CMOS technology; Communication networks; Driver circuits; Impedance; Integrated circuit interconnections; Integrated circuit measurements; Reflection; Semiconductor device measurement; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference, 1995., Proceedings of the IEEE 1995

Conference_Location

Santa Clara, CA

Print_ISBN

0-7803-2584-2

Type

conf

DOI

10.1109/CICC.1995.518221

Filename

518221