Title :
Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP ´97 (Cat. No.97TH8268)
Abstract :
The following topics are dealt with: packaging materials and process development; reliability; environmental and life cycle analysis; non-conductive adhesives; plastic encapsulation and underfilling technology; thermoplastic materials; polymeric substrate developments; insulators; glop-top and die-attach materials for microelectronics, opto-electronics and photonics packaging; surface laminated circuits; conductive adhesives for flip-chip; modelling and simulation
Keywords :
adhesion; encapsulation; environmental factors; integrated circuit packaging; life testing; microassembling; plastic packaging; polymer films; polymers; substrates; conductive adhesives; die-attach materials; environmental analysis; flip-chip; glop-top materials; life cycle analysi; microelectronics; modelling; non-conductive adhesives; opto-electronics; packaging materials; photonics packaging; plastic encapsulation; polymeric substrate; reliability; simulation; surface laminated circuits; thermoplastic materials; underfilling technology;
Conference_Titel :
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location :
Norrkoping, Sweden
Print_ISBN :
0-7803-3865-0
DOI :
10.1109/PEP.1997.656463
