Title :
Table of contents
fDate :
May 29 2012-June 1 2012
Abstract :
The following topics are dealt with: 3D interconnection bonding; next generation packaging reliability; MEMS integration; signal and power analysis; LED; optoelectronics integration; 3D reliability; interposer technology; sensors; conductive and nonconductive adhesives; advanced flip chip underfill assembly; solder and material characterization; 3D TSV manufacturing; flip chip interconnect and electromigration; 3D electrical analysis; lead free solders; innovative test methods; 3D ecosystem codesign; RF packaging; area array packages; advanced wire bonding; wafer level manufacturing; thermal interface materials; optical interconnects; and integrated microfluidics.
Keywords :
adhesion; electromigration; flip-chip devices; integrated circuit bonding; integrated circuit design; integrated circuit manufacture; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; integrated optoelectronics; lead bonding; light emitting diodes; microfluidics; optical interconnections; sensors; solders; three-dimensional integrated circuits; wafer level packaging; 3D TSV manufacturing; 3D ecosystem codesign; 3D electrical analysis; 3D interconnection bonding; 3D reliability; LED; MEMS integration; RF packaging; advanced flip chip underfill assembly; advanced wire bonding; area array packages; conductive adhesives; electromigration; flip chip interconnect; innovative test methods; integrated microfluidics; interposer technology; lead free solders; material characterization; next generation packaging reliability; nonconductive adhesives; optical interconnects; optoelectronics integration; power analysis; sensors; signal analysis; solder; thermal interface materials; wafer level manufacturing;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6248793
