Heat transfer through the interface containing sintered NanoAg based thermal interface material

The work in this article was aimed at the assessment of heat transfer through the system consists of stacked copper substrate, thermal interface material (TIM) and silicon die. Two types of TIMs studied within this paper were based on nano- and micro-sized particles of silver in various content rate of particles. The connection between chip and substrate made by TIM was achieved in sintering process. In order to evaluate the efficiency of heat flow through the samples Parker´s method was directly adopted. Results showed that specimens with TIM based on higher amount of silver nano-particles had higher effective diffusivity α_eff about 33% than the other ones in which TIM contained 10% less of silver nano-particles in its mixture.