DocumentCode
2721306
Title
Simulation challenges in designing high speed serial links
Author
Chada, Arun Reddy ; Mutnury, Bhyrav ; Wallace, Douglas ; Winterberg, Douglas ; Wang, Minchuan ; Scogna, Antonio Ciccomancini
Author_Institution
EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
fYear
2012
fDate
May 29 2012-June 1 2012
Firstpage
153
Lastpage
159
Abstract
Signal speeds of high speed serial links double almost every generation and with these increasing speeds come a wide range of new modeling and simulation challenges. Modeling challenges involve making sure that models are passive, stable and causal. Frequency-domain models, such as scattering parameter models that have measurement noise or limited bandwidth or incorrectly performed interpolation or extrapolation operations, may exhibit non-causality and non-passivity in time domain. Simulating millions of bits in timedomain to measure the interface merit in terms of bit error rate (BER) is CPU and memory intensive. This challenge has given way to new simulation algorithms and methodologies. The challenge here is that no two simulation approaches result in the same answer. The difference between approaches is aggravated at high frequencies and with inclusion of effects like crosstalk and transmitter and receiver equalization. In this paper, the results from various simulation approaches are contrasted against each other and also against measurements to understand their inherent assumptions along with their impact in designing high speed SerDes.
Keywords
S-parameters; integrated circuit modelling; peripheral interfaces; CPU; bit error rate; frequency domain model; high speed SerDes design; modeling challenge; noise measurement; scattering parameter model; simulation challenge; speed serial link designing; Convolution; Crosstalk; Data models; Integrated circuit modeling; Mathematical model; Scattering parameters; Time domain analysis; bit error rate; causality; interconnect; passivity; peak-distortion analysis; serial link; statistical approaches;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4673-1966-9
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2012.6248821
Filename
6248821
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