DocumentCode :
2721443
Title :
Fabrication of low cost wafer-level micro-lens arrays with spacers using glass molds by combining a Chemical Foaming Process (CFP) and a Hot Forming Process (HFP)
Author :
Qin, Shunjin ; Shang, Jintang ; Zhang, Li ; Wang, Tingting ; Lv, Siyuan ; Lai, Chiming ; Kuai, Wenlin ; Wei, Wenlong
Author_Institution :
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
fYear :
2012
fDate :
May 29 2012-June 1 2012
Firstpage :
213
Lastpage :
217
Abstract :
This paper reports an innovative molding process for the fabrication of low cost wafer-level micro-lens array with spacers of optical applications. The concave mold for the micro-lens includes two parts: the upper glass mold and the under silicon mold. The upper glass mold was prepared by combining the Hot Forming Process (HFP) and the Chemical Foaming Process (CFP). The under silicon mold was prepared by etching. Specially designed concave structures were prepared on both parts. An anti-adhesion layer was formed on the surface of the concave mold. UV-light curable glue, the lens material, was injected into the concave mold and cured. Results show that wafer-level micro-lens arrays with spacers were successfully fabricated after de-molding the reusable mold. Samples of 6×6 micro-lens arrays with spacers, in diameter of 800μm and pitch of 2600μm, were prepared. Fabrication imperfection and design of micro-lens array was discussed.
Keywords :
adhesion; etching; foams; microfabrication; microlenses; moulding; optical arrays; CFP; HFP; UV-light curable glue; antiadhesion layer; chemical foaming process; concave mold structure preparation; demolding fabrication; etching; hot forming process; lens material; optical application; size 2600 mum; size 800 mum; spacer; under silicon molding process; upper glass molding process; wafer-level microlens array; Cavity resonators; Chemicals; Fabrication; Glass; Lenses; Optical arrays; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2012.6248830
Filename :
6248830
Link To Document :
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