DocumentCode
2721443
Title
Fabrication of low cost wafer-level micro-lens arrays with spacers using glass molds by combining a Chemical Foaming Process (CFP) and a Hot Forming Process (HFP)
Author
Qin, Shunjin ; Shang, Jintang ; Zhang, Li ; Wang, Tingting ; Lv, Siyuan ; Lai, Chiming ; Kuai, Wenlin ; Wei, Wenlong
Author_Institution
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
fYear
2012
fDate
May 29 2012-June 1 2012
Firstpage
213
Lastpage
217
Abstract
This paper reports an innovative molding process for the fabrication of low cost wafer-level micro-lens array with spacers of optical applications. The concave mold for the micro-lens includes two parts: the upper glass mold and the under silicon mold. The upper glass mold was prepared by combining the Hot Forming Process (HFP) and the Chemical Foaming Process (CFP). The under silicon mold was prepared by etching. Specially designed concave structures were prepared on both parts. An anti-adhesion layer was formed on the surface of the concave mold. UV-light curable glue, the lens material, was injected into the concave mold and cured. Results show that wafer-level micro-lens arrays with spacers were successfully fabricated after de-molding the reusable mold. Samples of 6×6 micro-lens arrays with spacers, in diameter of 800μm and pitch of 2600μm, were prepared. Fabrication imperfection and design of micro-lens array was discussed.
Keywords
adhesion; etching; foams; microfabrication; microlenses; moulding; optical arrays; CFP; HFP; UV-light curable glue; antiadhesion layer; chemical foaming process; concave mold structure preparation; demolding fabrication; etching; hot forming process; lens material; optical application; size 2600 mum; size 800 mum; spacer; under silicon molding process; upper glass molding process; wafer-level microlens array; Cavity resonators; Chemicals; Fabrication; Glass; Lenses; Optical arrays; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4673-1966-9
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2012.6248830
Filename
6248830
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