• DocumentCode
    2721528
  • Title

    Gold passivated mechanically flexible interconnects (MFIs) with high elastic deformation

  • Author

    Zhang, Chaoqi ; Yang, Hyung Suk ; Bakir, Muhannad S.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    245
  • Lastpage
    250
  • Abstract
    This paper reports the fabrication and testing of gold passivated mechanically flexible interconnects (MFIs) with elastic deformation of 65 μm. It is shown that the gold passivation plays a critical role in preserving the lifetime of the flexible interconnects. The gold-passivated MFIs exhibit an unchanged force-displacement characteristic after being vertically indented 100 cycles.
  • Keywords
    elastic deformation; gold; indentation; integrated circuit interconnections; passivation; Au; elastic deformation; gold passivation; mechanically flexible interconnects; unchanged force-displacement characteristic; vertical indentation; Force; Gold; Passivation; Resistance; Silicon; Strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6248835
  • Filename
    6248835
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2721528