• DocumentCode
    2721776
  • Title

    Drop impact reliability of MEMS inertial sensors with membrane suspensions for mobile phones

  • Author

    Jong Woon Kim ; Heung Woo Park ; Min Kyu Choi ; Won Kyu Jeung ; Jung Won Lee

  • Author_Institution
    Corp. R&D Inst., AMD Lab., Samsung Electro-Mech., Suwon, South Korea
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    344
  • Lastpage
    349
  • Abstract
    MEMS accelerometers and gyroscopes enable new functions for portable electronics such as smartphones and tablet computers. Membrane suspensions are suitable for the inertial sensors using piezoelectric or piezoresistive effect, but they are susceptible to be damaged by drop impact. In this paper, system-level drop impact reliability was investigated for MEMS inertial sensors with membrane suspensions. Drop tests of the sensor modules mounted on mobile phone mockups were performed to observe effects of package parameters and impact orientation. After repeated drop tests, almost all membranes were broken while the failures could not be expected from component-level simulation. Therefore, a failure mechanism due to membrane buckling was suggested from system-level simulation and correlated with the drop test results. Based on the failure mechanism, new stopper design was applied and the drop impact failure was completely eliminated.
  • Keywords
    accelerometers; electronics packaging; failure analysis; gyroscopes; impact testing; microsensors; mobile handsets; notebook computers; reliability; MEMS accelerometers; MEMS gyroscopes; MEMS inertial sensors; drop impact reliability; failure mechanism; impact orientation; membrane buckling; membrane suspensions; mobile phones; package parameters; piezoelectric effect; piezoresistive effect; portable electronics; sensor modules; tablet computers; Acceleration; Micromechanical devices; Sensor phenomena and characterization; Sensor systems; Stress; Suspensions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6248853
  • Filename
    6248853