Abstract :
The following topics are dealt with: VLSI technology; memory devices; CMOS; ESD; flexible electronics; DRAM; metal gates; high-k dielectrics; BEOL; simulation, modeling and characterization
Keywords :
CMOS integrated circuits; DRAM chips; MOSFET; VLSI; electrostatic discharge; flexible electronics; high-k dielectric thin films; integrated circuit modelling; integrated memory circuits; semiconductor device models; 3D system integration technologies; BEOL; CMOS; ESD; VLSI technology; flexible electronics; high-k dielectrics; memory devices; metal gates; modeling; process integration; product integration; semiconductor manufacturing technology; simulation;
Conference_Titel :
VLSI Technology, Systems, and Applications, 2006 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
1-4244-0181-4
DOI :
10.1109/VTSA.2006.251107
