Novel interconnect materials for high reliability power converters with operation temperatures above 150°C

Power semiconductor modules are used in a wide field of applications and power ranges. Two common trends for these devices are miniaturization and cost reduction, leading to new requirements for dies, substrates and interconnect materials. As a result, the power density and therefore the operation temperature in the devices rise, creating the need for new interconnect materials. These materials must have high thermal and electrical conductivity to ensure excellent heat dissipation and thermo-mechanical stability. Consequently, the device operation temperature, which is currently limited to maximum 150°C, can be increased and the reliability of the module can be improved. The novel mAgic sinter materials feature highest thermal and electrical conductivity and can be used for operation temperatures above 150°C. This new material family provides a solution to reduce size and cost of high power semiconductor modules and, at the same time, improves the overall performance and reliability of these packages.