DocumentCode
2722709
Title
HfxTayNz Metal Gate Electrodes for Advanced MOS Devices Applications
Author
Cheng, Chin-Lung ; Chang-Liao, Kuei-Shu ; Wang, Tzu-Chen ; Wang, Tien-Ko ; Wang, Howard Chih-Hao
Author_Institution
Inst. of Mech. & Electro-Mech. Eng., Nat. Formosa Univ., Huwei
fYear
2006
fDate
24-26 April 2006
Firstpage
1
Lastpage
2
Abstract
With a small amount of hafnium (Hf) incorporated into tantalum nitride (TaN) metal gate, excellent thermal stability of electrical properties can be achieved up to post-metal anneal at 950 degC for 45 s. Besides, a work function tuning range from 4.2 to 4.6 eV can be obtained by suitably adjusting nitrogen (N) concentration in Hfx TayNz metal gate
Keywords
MIS devices; electric properties; electrochemical electrodes; hafnium compounds; tantalum compounds; thermal stability; work function; 4.2 to 4.6 eV; 45 s; 950 C; HfxTayNz; advanced MOS devices; electrical properties; excellent thermal stability; metal gate electrodes; nitrogen concentration; post-metal anneal; work function tuning range; Electrodes; Hafnium; High-K gate dielectrics; MOS devices; Nitrogen; Plasma temperature; Rapid thermal annealing; Temperature measurement; Thermal stability; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 2006 International Symposium on
Conference_Location
Hsinchu
ISSN
1524-766X
Print_ISBN
1-4244-0181-4
Electronic_ISBN
1524-766X
Type
conf
DOI
10.1109/VTSA.2006.251091
Filename
4016627
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