DocumentCode :
2722901
Title :
Resistive Loss and Trans-Impedance Characterization of Nonlinear Transmission Lines on CMOS SOI Substrate
Author :
Kim, Jinsook ; Ni, Weiping ; Kan, Edwin C.
Author_Institution :
Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY
fYear :
2005
fDate :
19-23 Sept. 2005
Firstpage :
203
Lastpage :
206
Abstract :
We report the characterization of nonlinear transmission lines (NLTL) implemented with the MIT Lincoln Lab 0.18mum FDSOI (fully-depleted silicon-on-insulator) CMOS process up to 35GHz directly from S-parameter measurements. NLTL interconnect can significantly reduce the effective resistance loss while maintaining comparable inductance, capacitance, and conductance to those of normal interconnect lines in a broadband of frequencies. Hence, the signal integrity in high-speed interconnects can be improved. NLTL also provides a convenient way to tune the transmission-line characteristic impedance for impedance matching at microwave frequencies. Excellent properties of return and insertion losses further illustrate the competitive advantage of the NLTL as the interconnect line on CMOS substrates for system-on-a-chip (SoC) applications
Keywords :
CMOS integrated circuits; S-parameters; field effect MMIC; impedance matching; integrated circuit interconnections; silicon-on-insulator; transmission lines; 0 to 35 GHz; 0.18 micron; CMOS SOI substrate; MIT Lincoln Lab FDSOI CMOS process; NLTL interconnect; S-parameter measurements; SoC applications; fully-depleted silicon-on-insulator; high-speed interconnects; impedance matching; insertion losses; microwave frequencies; nonlinear transmission lines; resistive loss; return losses; signal integrity; system-on-chip; transimpedance characterization; CMOS process; Capacitance; Electrical resistance measurement; Inductance; Propagation losses; Scattering parameters; Silicon on insulator technology; System-on-a-chip; Transmission line measurements; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOC Conference, 2005. Proceedings. IEEE International
Conference_Location :
Herndon, VA
Print_ISBN :
0-7803-9264-7
Type :
conf
DOI :
10.1109/SOCC.2005.1554495
Filename :
1554495
Link To Document :
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