• DocumentCode
    2722901
  • Title

    Resistive Loss and Trans-Impedance Characterization of Nonlinear Transmission Lines on CMOS SOI Substrate

  • Author

    Kim, Jinsook ; Ni, Weiping ; Kan, Edwin C.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY
  • fYear
    2005
  • fDate
    19-23 Sept. 2005
  • Firstpage
    203
  • Lastpage
    206
  • Abstract
    We report the characterization of nonlinear transmission lines (NLTL) implemented with the MIT Lincoln Lab 0.18mum FDSOI (fully-depleted silicon-on-insulator) CMOS process up to 35GHz directly from S-parameter measurements. NLTL interconnect can significantly reduce the effective resistance loss while maintaining comparable inductance, capacitance, and conductance to those of normal interconnect lines in a broadband of frequencies. Hence, the signal integrity in high-speed interconnects can be improved. NLTL also provides a convenient way to tune the transmission-line characteristic impedance for impedance matching at microwave frequencies. Excellent properties of return and insertion losses further illustrate the competitive advantage of the NLTL as the interconnect line on CMOS substrates for system-on-a-chip (SoC) applications
  • Keywords
    CMOS integrated circuits; S-parameters; field effect MMIC; impedance matching; integrated circuit interconnections; silicon-on-insulator; transmission lines; 0 to 35 GHz; 0.18 micron; CMOS SOI substrate; MIT Lincoln Lab FDSOI CMOS process; NLTL interconnect; S-parameter measurements; SoC applications; fully-depleted silicon-on-insulator; high-speed interconnects; impedance matching; insertion losses; microwave frequencies; nonlinear transmission lines; resistive loss; return losses; signal integrity; system-on-chip; transimpedance characterization; CMOS process; Capacitance; Electrical resistance measurement; Inductance; Propagation losses; Scattering parameters; Silicon on insulator technology; System-on-a-chip; Transmission line measurements; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference, 2005. Proceedings. IEEE International
  • Conference_Location
    Herndon, VA
  • Print_ISBN
    0-7803-9264-7
  • Type

    conf

  • DOI
    10.1109/SOCC.2005.1554495
  • Filename
    1554495