DocumentCode
2723005
Title
Including Power Supply Variations into Static Timing Analysis: Methodology and Flow
Author
Graziano, Mariagrazia ; Forzan, Cristiano ; Pandini, Davide
Author_Institution
Dipt. di Elettronica, Politecnico di Torino
fYear
2005
fDate
19-23 Sept. 2005
Firstpage
229
Lastpage
232
Abstract
In deep sub-micron technologies post-layout tuning analysis has become the most critical phase in the verification of large system-on-chip (SoC) designs with several power-hungry blocks. An increasingly important factor that can introduce a severe performance loss is the power supply noise. As technology advances into the nanometer regime, the operating frequencies increase, and clock gating has emerged as an effective technique to limit the power consumption in block-based designs. As a consequence, the amplitude of the supply voltage fluctuations has reached values where techniques to include the effect of power supply noise into timing analysis based on linear models are no longer adequate, and the non-linear dependence of cell delay from supply voltage must be considered. In this work we present a practical methodology that accurately takes into account the power supply noise effects in static timing analysis, which can be seamlessly included into an industrial sign-off design flow. The experimental results obtained from the timing verification of an industrial SoC design have demonstrated the effectiveness of our approach
Keywords
data flow analysis; formal verification; integrated circuit design; noise; power supply quality; system-on-chip; timing; block-based designs; clock gating; deep sub-micron technology; industrial SoC design; post-layout tuning analysis; power supply noise; power supply variations; sign-off design flow; static timing analysis; supply voltage fluctuations; Clocks; Electricity supply industry; Energy consumption; Frequency; Performance loss; Power supplies; System-on-a-chip; Timing; Tuning; Voltage fluctuations;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference, 2005. Proceedings. IEEE International
Conference_Location
Herndon, VA
Print_ISBN
0-7803-9264-7
Type
conf
DOI
10.1109/SOCC.2005.1554500
Filename
1554500
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