The size dependency of full IMC solder joint for 3D interconnection

Author

Mo, Liping ; Wu, Fengshun ; Liu, Changqing ; Xia, Weisheng

Author_Institution

Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2012

fDate

May 29 2012-June 1 2012

Firstpage

839

Lastpage

843

Abstract

The further miniaturization of electronic devices brings the challenge to the electronic packaging, especially for 3D interconnection as the miscrostructure of the solder joint could be replaced by IMC fully without any solder bulk remain. In this paper, both FE modeling and experimental testing were applied to investigate the stress distribution and the fracture mode of the solder joint under tensile load by considering the effect of IMC type and portion. Then, the size dependency regarding the IMC properties on grain size, defects, and crystallographic orientation has been pointed out to help understanding the reliability of full IMC joints.

Keywords

finite element analysis; fracture; grain size; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; solders; stress analysis; tensile testing; three-dimensional integrated circuits; 3D interconnection; FE modeling; crystallographic orientation; electronic devices; electronic packaging; experimental testing; finite element analysis; fracture mode; full IMC joint reliability; full IMC solder joint; grain defects; grain size; size dependency; solder joint microstructure; stress distribution; tensile load; Copper; Joints; Materials; Microstructure; Reliability; Soldering; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

978-1-4673-1966-9

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2012.6248931

Filename

6248931