• DocumentCode
    2723161
  • Title

    Preferred orientation of 30 μm fine pitch Sn2.5Ag micro-bumps studied by synchrotron polychromatic x-ray Laue microdiffraction

  • Author

    Tian, Tian ; Chen, Kai ; Kunz, Martin ; Tamura, Nobumichi ; Zhan, Chau-Jie ; Chang, Tao-Chih ; Tu, King-Ning

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Univ. of California, Los Angeles, CA, USA
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    882
  • Lastpage
    885
  • Abstract
    Synchrotron radiation white beam x-ray microdiffraction was employed to study grain size and orientation of fine pitch Sn2.5Ag micro-bumps. The indexing of the Laue patterns shows that there is mostly one dominant grain orientation in each micro-bump. Moreover, a statistics study based on the characterization of 72 micro-bumps, shows that the [001] direction, which is the fast diffusion path for Ni/Cu atoms in Sn tends to be parallel to the substrate of the test vehicle. This property remains stable after repeated reflow processes.
  • Keywords
    X-ray diffraction; fine-pitch technology; silver alloys; synchrotron radiation; tin alloys; Sn2.5Ag; fine pitch microbumps; reflow processes; size 30 mum; synchrotron polychromatic X-ray Laue microdiffraction; synchrotron radiation white beam X-ray microdiffraction; test vehicle substrate; Grain size; Integrated circuits; Nickel; Reliability; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6248938
  • Filename
    6248938