Title :
Adhesive flip chip bonding in a miniaturised spectrometer
Author :
Rusanen, Outi ; Keränen, Kimmo ; Blomberg, Martti ; Lehto, Ari
Author_Institution :
VTT Electron., Oulu, Finland
Abstract :
This paper discusses the selection of a suitable isotropically conductive adhesive for flip chip bonding of a micromachined component. The adhesive must have adequate electrical conductivity and mechanical bonding strength. Most commercial adhesives possess these qualities. In addition, small bumps of spherical shape need to be dispensed evenly and repeatedly. Eight adhesives were studied and one suitable candidate was found. The manufacture of the spectrometers proceeded successfully. The interferometer was fixed on top of a silicon detector by a flip chip technique using an isotropically conductive adhesive. Two prototype series with a total of 25 spectrometers have been produced, and 23 of them passed operational testing
Keywords :
adhesion; conducting polymers; electrical conductivity; elemental semiconductors; flip-chip devices; infrared detectors; infrared spectrometers; light interferometers; mechanical strength; microassembling; micromachining; microsensors; semiconductor device packaging; semiconductor device testing; silicon; Si; adhesive electrical conductivity; adhesive flip chip bonding; adhesive mechanical bonding strength; flip chip bonding; flip chip technique; interferometer; isotropically conductive adhesive; micromachined component; miniaturised spectrometer; operational testing; prototype spectrometers; silicon detector; spectrometer manufacture; spherical adhesive bumps; Bonding; Conductive adhesives; Conductivity; Detectors; Flip chip; Manufacturing; Prototypes; Shape; Silicon; Spectroscopy;
Conference_Titel :
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location :
Norrkoping
Print_ISBN :
0-7803-3865-0
DOI :
10.1109/PEP.1997.656479
