• DocumentCode
    2723325
  • Title

    High-Performance On-Chip Interconnect Circuit Technologies for sub-65nm CMOS

  • Author

    Kaul, Himanshu

  • Author_Institution
    Circuit Res. Lab., Intel Corp., Hillsboro, OR
  • fYear
    2005
  • fDate
    19-23 Sept. 2005
  • Firstpage
    324
  • Lastpage
    324
  • Abstract
    The continued increase in performance and integration levels of VLSI designs for the last three decades has been fueled by shrinking transistor sizes. Unlike devices, on-chip wires get slower with technology scaling and pose performance and power challenges as VLSI designs scale into the nanometer regime. At the same time signal integrity issues have also become important due to increased cross-talk and inductive effects and pose reliability challenges for on-chip signaling. In this tutorial the authors discussed various techniques for improving performance, energy-efficiency and signal integrity of on-chip signaling. The scope of these techniques includes solutions at the architectural, circuit and physical design level
  • Keywords
    CMOS integrated circuits; VLSI; integrated circuit design; integrated circuit interconnections; CMOS integrated circuit; VLSI designs; cross-talk effects; inductive effects; on-chip interconnect circuit technologies; on-chip signaling; on-chip wires; signal integrity; CMOS technology; Dynamic voltage scaling; Encoding; Energy consumption; Energy efficiency; Integrated circuit interconnections; Robustness; Technical Activities Guide -TAG; Very large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference, 2005. Proceedings. IEEE International
  • Conference_Location
    Herndon, VA
  • Print_ISBN
    0-7803-9264-7
  • Type

    conf

  • DOI
    10.1109/SOCC.2005.1554522
  • Filename
    1554522