• DocumentCode
    2723337
  • Title

    Assembly yield improvement of an asymmetric surface mountable transformer

  • Author

    Wang, Lejun ; Kim, Chunho ; Sleeper, Scott ; Hall, Gavin ; Dobbins, Julie ; McGuire, Molly

  • Author_Institution
    Medtronic Tempe Campus, Tempe, AZ, USA
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    948
  • Lastpage
    952
  • Abstract
    As microelectronic technology continues to evolve, it is finding increased applications in the medical sector, such as ever increased usage of microelectronics inside implantable medical devices. This market is driven by a set of challenging requirements that include form factor, weight, functionality, battery longevity, cost, and reliability, which requires in many cases custom developed packaging and assembly solutions. [1] A custom-designed surface mountable transformer with higher performance while enabling a smaller and more anatomically shaped device has been developed for a new implantable cardioverter defibrillator. The initial designs and prototypes of this transformer exhibited significant pre-production manufacturability issues and would have resulted in significant yield loss if implemented in high volume hybrid manufacturing. Predicted yield loss in high volume manufacturing was expected to be, on average, 15%. This paper provides an overview of various tools utilized and steps taken to identify root cause of major manufacturability issues, and subsequent yield improvements of this transformer in the surface mount process from 85% to greater than 99%.
  • Keywords
    defibrillators; prosthetics; surface mount technology; transformers; assembly yield improvement; asymmetric surface mountable transformer; implantable cardioverter defibrillator; preproduction manufacturability issue; Compounds; Geometry; Soldering; Surface treatment; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6248950
  • Filename
    6248950