Title :
Quantitative estimate of the characteristics of conductive particles in ACA by using nano indenter
Author :
Wang, Xitao ; Wang, Yanli ; Chen, Guoliang ; Liu, Johan ; Lai, Zonghe
Author_Institution :
State Key for Adv. Metals & Mater., Univ. of Sci. & Technol., Beijing, China
Abstract :
The characteristics of conductive particles in anisotropically conductive adhesives (ACA) were studied by optical microscopy observation and nano indenter measurements. The indentation measurement was performed at the particles in ACA joints using different bonding forces. The load-displacement curves and microhardness values are obtained, which indicate that the nano indenter could be used for quantitative estimation of the electrical and mechanical characteristics of conductive particles in ACAs
Keywords :
adhesion; conducting polymers; filled polymers; flip-chip devices; microhardness; nanotechnology; optical microscopy; packaging; ACA; ACA joints; anisotropically conductive adhesives; bonding forces; conductive particles; electrical characteristics; flip chip bonding; indentation measurement; load-displacement curves; mechanical characteristics; microhardness; nano indenter; nano indenter measurements; optical microscopy; quantitative estimation; Anisotropic magnetoresistance; Bonding forces; Conducting materials; Conductive adhesives; Conductivity measurement; Glass; Mechanical factors; Mechanical variables measurement; Optical microscopy; Particle measurements;
Conference_Titel :
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location :
Norrkoping
Print_ISBN :
0-7803-3865-0
DOI :
10.1109/PEP.1997.656480
