Title :
Finite element modeling of anomalous moisture diffusion with dual stage model
Author :
Fan, Xuejun ; Nagaraj, Vishal
Author_Institution :
Dept. of Mech. Eng., Lamar Univ., Beaumont, TX, USA
fDate :
May 29 2012-June 1 2012
Abstract :
In this paper, finite element modeling of anomalous moisture diffusion using commercial finite element code is developed. The modeling method and numerical implementation is based on a dual stage model with both stages described by Fickian terms mathematically. The method is also extended to desorption process at reflow, in which the permanently trapped moisture content is a function of temperature. This paper details the finite element modeling implementation steps for both moisture absorption and desorption. The results are compared to the analytical solutions, and are also compared to the experimental data. A single script using ANSYS APDL is developed for the whole process including absorption and desorption phases.
Keywords :
diffusion; finite element analysis; moisture; reflow soldering; ANSYS APDL; Fickian terms; anomalous moisture diffusion; commercial finite element code; dual stage model; finite element modeling; moisture absorption; moisture desorption; permanently trapped moisture content; reflow; temperature function; Absorption; Equations; Finite element methods; Materials; Mathematical model; Moisture; Semiconductor device modeling;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6248987