Effects of surface finish conditions on interfacial reaction characteristics and mechanical reliability of novel Sn-1.2Ag-0.7Cu-0.4In solder bump

Author

Kim, Jae-Myeong ; Kwak, Byung-Hyun ; Jeong, Myeong-Hyeok ; Yoo, Sehoon ; Park, Young-Bae

Author_Institution

Sch. of Mater. Sci. & Eng., Andong Nat. Univ., Andong, South Korea

fYear

2012

fDate

May 29 2012-June 1 2012

Firstpage

1272

Lastpage

1277

Abstract

The effect of interfacial microstructures on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder bumps with respect to the loading speed, annealing time, and surface finish was investigated. The shear force increased and the ductility decreased with increasing shear speed, primarily because of the time-independent plastic hardening and time-dependent strain-rate sensitivity of the solder alloy. The shear force and shear energy decreased for each surface finish under the high-speed shear test of 1000 mm/s as a result of increasing intermetallic compound (IMC) growth and pad interface weakness associated with increased annealing time. The organic solderability preservative (OSP) finish showed lower shear force compared to the electroless nickel immersion gold (ENIG) finish. With increasing annealing time, the ENIG finish and OSP finishes exhibited the pad open fracture.

Keywords

annealing; bonding processes; copper alloys; ductility; hardening; indium alloys; reliability; shear strength; silver alloys; solders; surface finishing; tin alloys; Pb-free solder bumps; SnAgCuIn; annealing time; bonding strength; ductility; high-speed shear test; interfacial microstructures; interfacial reaction; intermetallic compound; loading speed; mechanical reliability; organic solderability preservative; pad interface weakness; shear force; solder alloy; surface finish conditions; time-dependent strain-rate sensitivity; time-independent plastic hardening; Annealing; Force; Loading; Reliability; Soldering; Surface cracks; Surface finishing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

978-1-4673-1966-9

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2012.6248999

Filename

6248999