DocumentCode
2724136
Title
Bridging faults and their implication to PLAs
Author
Chandramouli, V. ; Gulati, Ravi K. ; Dandapani, R. ; Goel, Deepak K.
Author_Institution
Ford Microelectron. Inc., Colorado Springs, CO, USA
fYear
1990
fDate
10-14 Sep 1990
Firstpage
852
Lastpage
859
Abstract
A complete analysis of the bridging faults between gate outputs in FC (full complementary) MOS and PE (precharge evaluate) MOS is presented. It is shown that circuit design to force wired-AND or wired-OR effects in the presence of bridging faults leads to an adverse effect on noise margin, area, and speed. Hence, a functional testing is not desirable if FC MOS gates are employed, and the alternative method involving current testing should be used. In PE MOS gates, however, current testing is not possible, and, therefore, functional testing must be resorted to, despite the adverse side effects. The authors consider an area-efficient implementation of PLAs (programmable logic arrays) which uses both FC MOS and PE MOS logic, an implementation that is commonly used in VLSI designs. All possible classes of bridging faults in this implementation are identified and methods of detecting them are given
Keywords
MOS integrated circuits; VLSI; integrated circuit testing; logic arrays; logic testing; PLAs; VLSI designs; area-efficient implementation; bridging faults; current testing; full complementary MOS; functional testing; gate outputs; noise; precharge evaluate MOS; programmable logic arrays; wired-AND effects; wired-OR effects; CMOS logic circuits; Circuit faults; Circuit testing; Current measurement; Electrical fault detection; Fault detection; MOS devices; Programmable logic arrays; Springs; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1990. Proceedings., International
Conference_Location
Washington, DC
Print_ISBN
0-8186-9064-X
Type
conf
DOI
10.1109/TEST.1990.114103
Filename
114103
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