DocumentCode
2724242
Title
A fine pitch probe technology for VLSI wafer testing
Author
Tada, T. ; Takagi, R. ; Nakao, S. ; Hyozo, M. ; Arakawa, T. ; Sawada, K. ; Ueda, M.
Author_Institution
Mitsubishi Electr. Corp., Hyogo, Japan
fYear
1990
fDate
10-14 Sep 1990
Firstpage
900
Lastpage
906
Abstract
The limitations of the cantilevered wire probe card with respect to both pin count and pin pitch are pointed out. The authors then present the structure and electric characteristics of a novel wafer probe card and its prototype with 80-μm pitch and 479 electrodes, obtained by etching a photosensitive transparent glass. With this probe-card technology it is possible to probe LSI with higher pin count and finer pitch pads
Keywords
VLSI; integrated circuit testing; printed circuits; probes; test equipment; LSI; VLSI wafer testing; cantilevered wire probe card; electric characteristics; fine pitch probe technology; photosensitive transparent glass; pin count; pin pitch; wafer probe card; Electric variables; Electrodes; Etching; Glass; Large scale integration; Probes; Prototypes; Testing; Very large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1990. Proceedings., International
Conference_Location
Washington, DC
Print_ISBN
0-8186-9064-X
Type
conf
DOI
10.1109/TEST.1990.114110
Filename
114110
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