Glob-top reliability characterisation: evaluation and analysis methods

Author

Doyle, Rory ; Flynn, Brendan O. ; Lawton, Willie ; Barrett, John ; Buckley, Jason

Author_Institution

Nat. Microelectron. Res. Centre, Univ. Coll. Cork, Ireland

fYear

1997

fDate

26-30 Oct 1997

Firstpage

169

Lastpage

177

Abstract

Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques

Keywords

consumer electronics; encapsulation; failure analysis; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; nondestructive testing; consumer products; destructive analysis techniques; electronics assembly; encapsulation method; failure mechanisms; failure modes; glob-top encapsulation; glob-top performance; glob-top reliability; glob-top reliability tests; harsh environment conditions; high reliability devices; nondestructive analysis techniques; reliability; reliability analysis methods; reliability evaluation; Assembly; Educational institutions; Encapsulation; Failure analysis; Materials reliability; Microassembly; Microelectronics; Packaging; Testing; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on

Conference_Location

Norrkoping

Print_ISBN

0-7803-3865-0

Type

conf

DOI

10.1109/PEP.1997.656487

Filename

656487