DocumentCode :
2724428
Title :
An accurate current reference using temperature and process compensation current mirror
Author :
Yang, Byung Do ; Shin, Young Kyu ; Lee, Jee Sue ; Lee, Yong Kyu ; Ryu, Keuu Chul
Author_Institution :
VLSI Circuit & Syst. Lab., Chungbuk Nat. Univ., Cheongju, South Korea
fYear :
2009
fDate :
16-18 Nov. 2009
Firstpage :
241
Lastpage :
244
Abstract :
In this paper, an accurate current reference using temperature and process compensation current mirror (TPC-CM) is proposed. The temperature independent reference current is generated by summing a proportional to absolute temperature (PTAT) current and a complementary to absolute temperature (CTAT) current. The temperature coefficient and magnitude of the reference current are influenced by the process variation. To calibrate the process variation, the proposed TPC-CM uses two binary weighted current mirrors which control the temperature coefficient and magnitude of the reference current. After the PTAT and CTAT currents are measured, the switch codes of the TPC-CM are fixed in order that the magnitude of reference current is independent to temperature. And, the codes are stored in the non-volatile memory. In the simulation, the effect of the process variation is reduced to 0.52% from 19.7% after the calibration using a TPC-CM in chip-by-chip. A current reference chip is fabricated with a 3.3V 0.35um CMOS process. The measured calibrated reference current has 0.42% variation.
Keywords :
CMOS analogue integrated circuits; current mirrors; reference circuits; CMOS; accurate current reference; size 0.35 micron; temperature and process compensation current mirror; temperature independent reference current; voltage 3.3 V; Current measurement; Diodes; Mirrors; Nonvolatile memory; Resistors; Semiconductor device measurement; Solid state circuits; Switches; Temperature control; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2009. A-SSCC 2009. IEEE Asian
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4433-5
Electronic_ISBN :
978-1-4244-4434-2
Type :
conf
DOI :
10.1109/ASSCC.2009.5357223
Filename :
5357223
Link To Document :
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