• DocumentCode
    2724500
  • Title

    [Front cover]

  • fYear
    2009
  • fDate
    16-18 Nov. 2009
  • Abstract
    The following topics are dealt with: IC packaging; CMOS nanoelectronic devices; computing technologies; advances in wireless and multimedia; analog filters; RF synthesizers; low power circuit techniques; bio and emerging applications including MEMS, optical communication, and RFID tag; analog-to-digital converters; wireline communication circuits; image signal processing; memory including DRAM, SRAM, and flash memories; advanced analog techniques; RF building blocks and phased array receivers; low-power system integration techniques and bio-medical DSPs; inductive link and clock generation; power management; RF transceivers and SoC; and digital communication including decoder chips.
  • Keywords
    CMOS integrated circuits; DRAM chips; SRAM chips; analogue-digital conversion; biomedical electronics; clocks; decoding; digital communication; digital signal processing chips; electronic engineering computing; filters; flash memories; image processing; integrated circuit packaging; low-power electronics; micromechanical devices; multimedia systems; nanoelectronics; optical communication; radiofrequency identification; radiofrequency integrated circuits; system-on-chip; telecommunication links; transceivers; CMOS nanoelectronic devices; DRAM; IC packaging; MEMS; RF building blocks; RF synthesizers; RF transceivers; RFID tag; SRAM; SoC; advanced analog techniques; analog filters; analog-to-digital converters; biomedical DSP; clock generation; computing technologies; decoder chips; digital communication; flash memories; image signal processing; inductive link; low power circuit techniques; low-power system integration techniques; multimedia; optical communication; phased array receivers; power management; wireless technology; wireline communication circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2009. A-SSCC 2009. IEEE Asian
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4433-5
  • Type

    conf

  • DOI
    10.1109/ASSCC.2009.5357228
  • Filename
    5357228