Title :
A 1.8dB NF 300mW SiP for 2.6GHz diversity S-DMB application
Author :
Hong, Seokyong ; Kang, Tae-Shin ; Hwang, Myung-Woon ; Beck, Sungho ; Lee, Jeong-Cheol ; Ahn, Moon-Kyung ; Jo, Hyunha ; Lim, Seungbum ; Kim, Taeshin ; Lee, Sangjin ; Yoo, Seungyup ; Lee, Jong-Ryul ; Han, Sangwoo
Author_Institution :
Future Commun. IC Inc., Sungnam, South Korea
Abstract :
This paper presents a 1.8 V 300 mW System-In-Package (SiP) solution in mobile S-DMB application. This achieves a 1.8 dB noise figure at 2.6 GHz, while the measured sensitivity is -101 dBm at diversity mode. The SiP is integrated RF tuner, demodulator, SDRAM and other passive components. An internal AGC is integrated for over 100 dB dynamic range. The SiP is 196 pins LFBGA and the size is 10 mm × 10 mm × 1.3 mm. The SiP consumes 300 mW.
Keywords :
mobile communication; system-in-package; SDRAM; demodulator; frequency 2.6 GHz; integrated RF tuner; internal AGC; mobile S-DMB application; noise figure 1.8 dB; passive components; power 300 mW; system-in-package solution; voltage 1.8 V; Adaptive filters; Application specific integrated circuits; Baseband; Demodulation; Dynamic range; Energy consumption; Noise measurement; Packaging; Radio frequency; Tuners; RF tuner; S-DMB; System-in-Package;
Conference_Titel :
Solid-State Circuits Conference, 2009. A-SSCC 2009. IEEE Asian
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4433-5
Electronic_ISBN :
978-1-4244-4434-2
DOI :
10.1109/ASSCC.2009.5357239
