Title :
Green future: IC packaging opportunities abound
Author_Institution :
Group R&D, ASE Group, Kaohsiung, Taiwan
Abstract :
Today, as global environmental regulations are being tightened, both IC and package technologies are also becoming far more complicated. More Moore and more than Moore, which manifest themselves in system-on-chip (SoC) and system-in-a-package (SiP), respectively, are being used more in combination to meet the ever-more-stringent cost and time-to-market requirements of consumer products with more functions built in them. In this presentation, I will review the challenges and opportunities to IC packaging as a direct outcome of the above trends to ensure SoC and SiP based IC packages meet the needs of the present generation without compromising the ability of future generations.
Keywords :
consumer products; environmental factors; semiconductor industry; system-in-package; system-on-chip; IC packaging; SiP; SoC; consumer products; cost requirements; system-in-a-package; system-on-chip; time-to-market requirements; Acceleration; Cellular phones; Consumer products; Costs; Electronics industry; Integrated circuit packaging; Lead; Planets; Research and development; Time to market;
Conference_Titel :
Solid-State Circuits Conference, 2009. A-SSCC 2009. IEEE Asian
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4433-5
Electronic_ISBN :
978-1-4244-4434-2
DOI :
10.1109/ASSCC.2009.5357242
